IC card module peeling tester
PRODUCTION EQIPMENTS
Shipping cards that can be relied on
This device detects defects in the adhesion of modules to contact IC cards, stressing the cards on their long and short sides with a patent-pending detection method.
This test reveals likely-to-peel modules, consequently providing confidence in the shipment of IC cards than can be used in tough conditions.
| Basic functions | Bending (from the long/short sides) and adhesion test Bending (from the long/short sides) and polling test Bending (from the long/short sides) and DC characteristics test Appearance (flaws and color irregularity) inspection of contact IC card modules |
|---|---|
| Referential main body size | 2800Wx1800Hx900D (mm) |
| Facility requirements | Three-phase AC 200V/30A Air 0.5Mpa 70L/min |
[Long-side bending test]
[Short-side bending test]
[Appearance inspection]
[Testing module]
